本产品是一款单组份热固化导电环氧树脂胶粘剂,其固化物粘接强度高,电阻率低,具有很好的导电传导特性,推出市场10多年来,受到了广大客户的好评。
本产品完美解决了传统的磁芯接地贴铜箔的工艺,使原本繁琐的生产工艺变得简单,自动化作业效率更高,且粘接强度更高,产品可靠性更强;
H907-C-2是一种单组份粘稠性导电胶,是以热固性环氧树脂为基体的导电性胶粘剂。广泛应用在半导体工业、半导体芯片的粘贴以及各类需导电电子元器件粘接固定;推荐应用于变压器接地磁芯与铜线粘接,具有较低之电阻率及较高之粘接强度;固化物具有优良的导电性、耐热性及良好胶接强度. 替代传统的贴铜箔工艺,可进行自动化生产作业,效率更高。
外观及物性
外观 粘稠膏状体
颜色 黑色
比重(25℃) 1.1-1.25
粘度 (25℃) 25000-45000 cps
保存期限 25度2个月,5度3个月
包装 1KG
固化条件: 120℃/1-1.5小时; (点胶较厚时建议延长烘烤时间)
固化后特性
硬 度 Shore D 75-85
热变形温度 ℃ 130
体积电阻率 Ω- 0.5cm 小于200
This product is a one component heat curable conductive epoxy resin adhesive with high bonding strength, low resistivity and good conductive properties. It has been put into the market for more than 10 years and has been well received by customers.
This product perfectly solves the traditional magnetic core grounding copper foil process, making the original cumbersome production process become simple, automation operation efficiency is higher, and the bonding strength is higher, and the product reliability is stronger;
H907-c-2 is a kind of one component viscous conductive adhesive, which is based on thermosetting epoxy resin. It is widely used in semiconductor industry, semiconductor chip bonding and various kinds of conductive electronic components; it is recommended to be used for bonding transformer grounding magnetic core and copper wire, with low resistivity and high bonding strength; The cured product has excellent conductivity, heat resistance and good bonding strength. It can replace the traditional copper foil bonding process and can carry out automatic production with higher efficiency.
东莞市华创电子材料有限公司/东莞市华创绝缘材料有限公司/昆山市华创电子材料有限公司
专业的胶粘剂研发生产企业!始于1999年,因为专业,相信我们会做得更好!。
环氧树脂胶,电子灌封胶,结构胶,单组份环氧树脂胶,环氧AB胶,密封胶,UV胶,导电/导磁/耐高温/阻燃环氧胶,胶粘剂定制,邦定胶,电子胶水,红胶,黑胶,白胶,磁芯胶,SMT红胶,底填胶,低温快固化环氧,胶粘剂,胶黏剂,UL胶水;联络人:王先生 电话:13712306987 (微信号同)。
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